The more precise the product, the stric上兵ter the control of its manufacturing身自 process, the higher the re機醫quirements of its manufacturing proc現就ess, and the higher the degree o分生f automation in order to improve 可慢production effici理麗ency. Taking the chip packagi睡國ng industry as 離南an example, in the packa輛樂ging process, automated di弟她spensing equipment must be used in話畫 many places for processing instead紅話 of manual dispensin事她g.

One: Bottom filling &nbs商作p;    

Many technicians have encoun答很tered such a problem.她花 During the flip-chip process, because 暗山the fixed area i相對s smaller than the chip area, it is妹一 difficult to bond媽少. If the chip is subjec數答ted to impact or 件從heat expansion, it is easy to cause t兒地he bump to break, an微音d the chip will lose its proper perfor生資mance. In order to solve this proble船你m, it is necessary to inject organi算訊c glue into the ga他工p between the chip and近看 the substrate through an automatic g刀畫lue dispenser, and t行錯hen cure it, which not only effectively紙家 increases the connection area betw女我een the chip and the substrate, but上內 also further improves their bondin工黑g strength. , has a v用對ery good protective effect on the b草藍ump.

Two: Die Bonding  西習;    

PCB is very eas醫高y to shift duri她愛ng the bonding process. In order to av信暗oid electronic co線草mponents falling off or是中 shifting from the surface下資 of the PCB, it is necessary to use a 計說fully automatic dispensing m紙志achine to dispense glue on t個雜he surface of the PCB, and then place 用路it on the surface of the PCB. It is 計關heated and cured in an oven, so that姐技 the electronic components can 西拿be firmly bonded to the 綠街PCB.

Three: Surface Coating   &這煙nbsp;  

In addition, after the chi從影p is soldered, it is neces外她sary to apply a layer of epo弟拿xy resin with low海男 viscosity and good fluidit錯吧y between the ch票現ip and the solder joint thro笑內ugh the automatic glue dispenser視放 and cure, so that the chip not only im美慢proves the appeara件喝nce A grade, and can prev白什ent the erosion and s開子timulation of foreign objects, can prot又藍ect the chip well, there西報by prolonging the 老但service life of the chip.   報內   

When packaging small items li術區ke chips, if manual dispensi不制ng is used, the dispensing speed c理體annot be slow, and it is d喝購ifficult to control the 相海amount of dispensing stably, whi購影ch not only affects t跳不he production sp書看eed of the product不那, but also may cause problem國錯s. affect the quality路這 of the product. Therefore, f在如or such precision operations, automated拍人 equipment is the be東拍st choice for manufacturers.